On Wednesday, October 22, Estonia, Latvia, and Lithuania signed a memorandum of understanding (MoU) at the Techritory 2025 forum in Riga to strengthen cooperation between their national chip competence centers.
The memorandum brings together organizations representing the microchip competence centers of the respective countries: Riga Technical University (RTU) and the University of Latvia, the Lithuanian Center for Physics and Technology (FTMC), and the Metrosert Applied Research Center from Estonia. By harmonizing national strategies and combining expertise, the aim is to accelerate innovation, expand research capabilities, and strengthen the role of the Baltic-Nordic countries in the European semiconductor value chain.
Indrek Tulp, member of the Metrosert board and head of the applied research center, said that the partnership will contribute to the creation of a strong and resilient semiconductor ecosystem. “The Estonian Chip Competence Center, which operates under the Applied Research Center, focuses on direct cooperation with companies and the development of practical industrial solutions. Through Baltic cooperation, we ensure that new technological solutions move more quickly from research to industry, supporting European technological sovereignty and competitiveness,” said Tulp.
RTU Vice-Rector for Innovation Liene Briede emphasized that Riga Technical University has taken the lead in strengthening Baltic cooperation. “The next step is to extend this initiative to the Nordic countries. The Baltic partnership is an excellent platform that supports small and medium-sized enterprises, start-ups, and research institutions in the region and increases the region’s visibility in the global value chain,” Briede noted.
Ramūnas Skaudžius, Director of the Lithuanian Center for Physical Sciences and Technology (FTMC), added that the agreement will strengthen the research and development capabilities of the entire region. “Baltic cooperation creates a powerful platform that combines knowledge and expertise in both the Baltic and Nordic countries. For Lithuania, this means transforming our strong research base into tangible industrial impact,” said Skaudžius.
The agreement was signed at a time when Europe is seeking to reduce its dependence on global supply chains and strengthen its technological autonomy. In the spring of 2025, the aCCCess (Alliance of Chips Competence Centres for Enhanced Semiconductor Services) initiative was launched to support EU-wide cooperation in the field of semiconductors. With this memorandum, the Baltic states support the European Chips Act’s goal of doubling the region’s production capacity by 2030.
The next step for the Baltic partners is a joint HORIZON-CSA application, which aims to map the regional semiconductor ecosystem and create a joint strategy for establishing a Baltic-Nordic semiconductor alliance.
The Estonian Chip Technology Competence Center is led by a consortium consisting of the Enterprise and Innovation Foundation (EIS), the Metrosert applied research center, and the Estonian Electronics Industry Association (EETL), in cooperation with TalTech, the University of Tartu, and leading electronics companies.
The memorandum focuses on three main areas of cooperation:
- Increasing innovation and visibility through joint international representation, positioning the Baltic region as an emerging microchip hub;
- Promoting research and education through joint training programs and knowledge exchange;
- Supporting start-ups and SMEs to facilitate their access to research and pilot infrastructure within the framework of the Chips Joint Undertaking (Chips JU) programs.
Photo from the signing ceremony on October 22 in Riga, from left: Kristjan Kaunissaare, EIS chip technology and design project manager (representing Estonia at the signing), Ramūnas Skaudžius, Director of the Lithuanian Center for Physical Sciences and Technology, Guntars Kitenbergs, Vice-Rector for Research at the University of Latvia, and Liene Briede, Vice-Rector for Innovation at Riga Technical University.