{"id":3232,"date":"2025-12-12T13:53:04","date_gmt":"2025-12-12T11:53:04","guid":{"rendered":"https:\/\/kiip.ee\/?page_id=3232"},"modified":"2026-04-28T11:25:00","modified_gmt":"2026-04-28T08:25:00","slug":"pilot-lines","status":"publish","type":"page","link":"https:\/\/kiip.ee\/en\/pilot-lines\/","title":{"rendered":"Pilot Lines"},"content":{"rendered":"\n
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Pilot-to-Production: Chips JU Pilot Lines<\/h2>\n\n\n\n

KIIP also provides access to the first five open-access pilot lines of Chips JU<\/strong><\/a>, enabling companies, research institutions, and start-ups to prototype and scale innovative semiconductor solutions. The Chips Joint Undertaking (Chips JU) has launched five open-access pilot lines across Europe to enable prototyping, R&D, testing, and early manufacturing of next-generation semiconductor technologies. These facilities are part of the Chips for Europe Initiative under the EU Chips Act.<\/p>\n\n\n\n

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Available Pilot Lines<\/h3>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n
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NanoIC: Beyond-2 nm Leading-Edge System-on-Chip<\/strong><\/strong><\/h3>\n\n\n\n

What it is:<\/strong> A pilot line enabling state-of-the-art CMOS technologies beyond the 2 nm node for advanced SoC development, targeting logic, memory, and interconnect innovation.
Learn more \/ access:<\/strong><\/p>\n\n\n\n

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FAMES: Fully Depleted SOI Applications<\/strong><\/strong><\/strong><\/h3>\n\n\n\n

What it is:<\/strong> Pilot line focused on FD-SOI technology with a roadmap to low-power, high-performance semiconductor solutions including embedded memories, RF, and 3D integration.
Learn more \/ access:<\/strong><\/p>\n\n\n\n

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APECS: Advanced Packaging & Heterogeneous Integration<\/strong><\/strong><\/strong><\/strong><\/h3>\n\n\n\n

What it is:<\/strong> Pilot line for advanced packaging, chiplet integration and heterogeneous system technologies, coordinated by a Fraunhofer-led consortium.
Learn more \/ access:<\/strong><\/p>\n\n\n\n

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WBG: Wide Bandgap Materials (SiC & GaN)<\/strong><\/strong><\/strong><\/strong><\/strong><\/h3>\n\n\n\n

What it is:<\/strong> Pilot line developing wide bandgap semiconductor devices (such as SiC and GaN) for high-performance power and RF electronics applications.
Learn more \/ access:<\/strong><\/p>\n\n\n\n

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PIXEurope: Photonic Integrated Circuits<\/strong><\/strong><\/strong><\/strong><\/strong><\/strong><\/h3>\n\n\n\n

What it is:<\/strong> A pilot line initiative to build an open-access photonic integrated circuits (PIC) ecosystem, covering design, fabrication, integration, testing and reliability technologies.
Learn more \/ access:<\/strong><\/p>\n\n\n\n

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These pilot lines, available via Chips JU and supported by KIIP, help bridge the gap between research-level design and industrial-scale manufacturing. They offer the infrastructure and expertise to validate and scale novel semiconductor technologies under open, non-discriminatory access.<\/p>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

Pilot-to-Production: Chips JU Pilot Lines KIIP also provides access to the first five open-access pilot lines of Chips JU, enabling companies, research institutions, and start-ups to prototype and scale innovative semiconductor solutions. The Chips Joint Undertaking (Chips JU) has launched five open-access pilot lines across Europe to enable prototyping, R&D, testing, and early manufacturing of […]<\/p>\n","protected":false},"author":12,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-3232","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/pages\/3232","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/users\/12"}],"replies":[{"embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/comments?post=3232"}],"version-history":[{"count":13,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/pages\/3232\/revisions"}],"predecessor-version":[{"id":3496,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/pages\/3232\/revisions\/3496"}],"wp:attachment":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/media?parent=3232"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}