{"id":3419,"date":"2026-03-11T12:17:51","date_gmt":"2026-03-11T10:17:51","guid":{"rendered":"https:\/\/kiip.ee\/?p=3419"},"modified":"2026-03-11T15:09:17","modified_gmt":"2026-03-11T13:09:17","slug":"estonia-showcases-semiconductor-innovation-at-europes-first-enccc-annual-conference","status":"publish","type":"post","link":"https:\/\/kiip.ee\/en\/estonia-showcases-semiconductor-innovation-at-europes-first-enccc-annual-conference\/","title":{"rendered":"Estonia Showcased Semiconductor Innovation at the First ENCCC Annual Conference in Brussels"},"content":{"rendered":"\n
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On 5\u20136 February in Brussels, the first annual conference of the European Network of Chips Competence Centres (ENCCC) brought together all 30 European semiconductor technology competence centres (CCCs), along with representatives from EU pilot lines, chip design platforms, industrial alliances, and key ecosystem partners.<\/strong><\/p>\n\n\n\n

The Estonian Estonian Chips Competence Center KIIP was also represented at the conference by a delegation consisting of Andres Mellik<\/strong> (Metrosert, Programme Manager of the Chip Center), Jaan Raik<\/strong> (Project Manager of the KIIP project), Kristo Klesment<\/strong> and Kristjan Kaunissaare<\/strong> (Enterprise Estonia, EIS).<\/p>\n\n\n\n

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Estonia was one of eight countries to deliver a pitch presentation, highlighting success stories from the past year in collaboration with local industry. Estonia\u2019s strengths were noted as the numerous industrial contacts established and concrete steps taken to support companies transitioning to chip manufacturing. Special attention was drawn to Europe\u2019s unique microdegree<\/a>, launched with the support of the Chip Center at TalTech in February this year.<\/p>\n\n\n\n

The Estonian Chips Competence Center KIIP was launched in March 2025. Its activities are funded by the Ministry of Economic Affairs and Communications and the EU Chips JU programme.<\/p>\n","protected":false},"excerpt":{"rendered":"

On 5\u20136 February in Brussels, the first annual conference of the European Network of Chips Competence Centres (ENCCC) brought together all 30 European semiconductor technology competence centres (CCCs), along with representatives from EU pilot lines, chip design platforms, industrial alliances, and key ecosystem partners.<\/p>\n","protected":false},"author":7,"featured_media":3415,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[23],"tags":[],"class_list":["post-3419","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"acf":[],"_links":{"self":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/posts\/3419","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/comments?post=3419"}],"version-history":[{"count":7,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/posts\/3419\/revisions"}],"predecessor-version":[{"id":3427,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/posts\/3419\/revisions\/3427"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/media\/3415"}],"wp:attachment":[{"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/media?parent=3419"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/categories?post=3419"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/kiip.ee\/en\/wp-json\/wp\/v2\/tags?post=3419"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}